H200 vs MI355X

The ratio of FP16 dense to FP32 performance equals 989 divided by 67 on the H200 and 2500 divided by 157.3 on the MI355X. This ratio indicates how effectively each GPU accelerates mixed precision workloads relative to full precision baselines during training and inference. The MI355X supplies 2500 TFLOPS FP16 dense compared with 989 TFLOPS FP16 dense on the H200. The MI355X also supplies 5000 TFLOPS FP16 with sparsity compared with 1979 TFLOPS FP16 with sparsity on the H200. Memory bandwidth of 8000 GB/s on the MI355X versus 4800 GB/s on the H200 permits larger batch sizes before memory capacity limits are reached. The 288 GB VRAM on the MI355X versus 141 GB VRAM on the H200 further extends the feasible batch sizes for models that exceed the smaller capacity.

The H200 suits deployments where total power draw must remain at 700W. Its support for NVLink interconnect and SXM or NVL form factors fits existing NVIDIA centric clusters. The lower TDP of 700W versus 1400W reduces cooling infrastructure requirements when FP16 dense performance of 989 TFLOPS meets workload targets.

The MI355X suits deployments that require 288 GB VRAM and 8000 GB/s bandwidth to accommodate larger models. Its FP16 dense rating of 2500 TFLOPS and FP32 rating of 157.3 TFLOPS accelerate workloads that scale with these higher figures. The OAM form factor and Infinity Fabric interconnect align with systems designed around those interfaces.